ROLEC’s IoT/IIoT Round Enclosures Now In Plastic Too

pr2004-round-enclosures-niot

April 2020

Round enclosures for Industry 4.0/IoT/IIoT electronics are now available from ROLEC in UV-stable plastic as well as diecast aluminium.

Robust technoDISC (IP 67) is the ASA Luran version of aluDISC (IP 66/67/69K), the world’s first round diecast aluminium enclosures for industrial electronics.

Both models are ‘go anywhere’ enclosures that can be fitted to walls, bulkheads and machines. Their round design integrates visually when used in applications such as industrial pipework, shipboard equipment and vehicles. But technoDISC – being plastic – is light weight and lower cost, making it ideal for Industry 4.0, IoT and IIoT electronics.

Both enclosures can be installed ‘lid closed’ – safeguarding the seal and electronics. Clip-on covers hide the lid screws and mounting holes. The lid is recessed to accommodate a membrane keypad or product label. Screw pillars in the lid and base enable PCBs, mounting plates and electronic assemblies to be fitted.

ROLEC technoDISC and aluDISC are available in four sizes from 110 x 97 x 55 mm to 190 x 179 x 90 mm, offering optimum internal space for a wide variety of electronic and electrical components. The AR 120 size of aluDISC (150 x 139 x 80 mm) is also available with a transparent polycarbonate cover to protect displays. The standard colour scheme for both models is light grey (RAL 7035) with plastic POM covers in anthracite grey (RAL 7016).

Options and accessories for both models include EMC shielding and a mounting plate. For aluDISC there are also concealed lid supports and a corrosion-proof coating in azure blue (RAL 5009).

ROLEC can supply both models fully customised. Services include CNC machining, painting, powder coating, digital printing, engraving, laser processing, EMC shielding, special materials, membrane keypads, display windows and full assembly.

For the plastic version:

View technoDISC range >>

For the diecast aluminium version:

View aluDISC range >>

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